소닉스비오엠

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Business introduction

Key Technologies

CVD SiC Electrode (ELECTRODE), a product of Sonics', is rapidly changing the market due to the recent increase in highly integrated circuit semiconductors, which requires new processing technologies.

Changes in the market and demands for new technologies

market changes
Expanding products below 5 nanometers
  • material change
  • Increasing the number of machined holes
  • an increase in thickness
  • change in form
  • Maximize use time
Development/Application of Ultra-Hard Materials
Ultra-hard semiconductor material (CVD SiC/TC Bond)
Ultra-hard semiconductor material (CVD SiC/TC Bond)
Ultrasonic Processing Technology
New Technology Requirements
Difficulty in MCT/laser machining
  • CVD SiC material processing difficulty
  • Difficulty in thickness machining
  • Insufficient form and precision
  • Chipping, Particles, Cracks
  • Excessive processing time
Development of New Material Processing Technology

Key areas of technology development

Development of high-performance oscillators
Best current frequency bandwidth competitor: 19khz / Sonics: 189khz~24khz
Ultra-precise, Large-Scale Mixed Development
Competitor: 240 X 240mm / Sonics: 340 X 340mm (one-shot processing available for 12" Wafer)
Development of Room Temperature Curing Adhesive
High-temperature processing tolerance and precision issues resolved competitor: 175º / Sonics: 0~45º
Development of Shape Processing Tool
Securing special shape processing technology Competitor: Circular / Sonics: Special shape

Competitiveness Comparison of Related Technologies (SiC)

Competitiveness Comparison of Related Technologies (SiC)
Sortation MCT Lazer third-party ultrasound Sonics ultrasound Remarks
Pattern processing Special shapes possible
Curved machining -
Lamination processing X -
Thickness and Depth X SiC 10T is possible
Processing speed X -
large cavity Mass defects occur in other technologies during large-scale hole processing
large-area processing X -

video

Company Introduction Video
2026.06.19